Nine Radiation-Hardened ICs Using VORAGO Technologies HARDSIL®
Technology Launched for International Space Station
Austin, TX — February 19th, 2016 — VORAGO Technologies, a
leading provider of radiation-hardened and extreme temperature embedded systems
technology, today announced that nine CMOS silicon die, based upon patented and
proven HARDSIL® technology, were launched on the SpaceX Falcon 9
CRS-10 cargo resupply mission to the International Space Station.
Microcontroller and SRAM memory devices based upon VORAGO’s HARDSIL
technology will be used in an important science study, sponsored by Air Force
Research Laboratory and hosted on the STP-H5 experiment payload by the Air
Force Space and Missle System Center Space Test Payload group and NASA. The electronics module was developed by the Air Force Research Laboratory (AFRL) and built by the COSMIAC Research Center at the University of New Mexico.
The purpose of the mission is to study the frequency and effect of high
energy particle strikes on CMOS memory devices in space. An array of HARDSIL based
memory chips is monitored and controlled by a VORAGO Technologies ARM
Corex®-M0 based microcontroller.
“We are delighted to be participating in this mission on the
International Space Station,” said Bernd Lienhard, chief executive officer of
VORAGO Technologies. “The products are a great fit for the project, because
HARDSIL immunizes chips against radiation induced latch-up. Our
microcontrollers are growing in popularity in small satellite designs as we
have proven technology to perform in extreme radiation environments”.
HARDSIL is a process enhancement to standard Bulk CMOS manufacturing
that hardens devices against the effects of radiation and temperature. HARDSIL
can be used to harden any CMOS device using standard manufacturing equipment
with no negative impact on performance or yields. This approach is a
cost-effective alternative to current high-reliability techniques that use specialized
manufacturing techniques, up-screened commercial products, redundant systems,
or exotic packaging.